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GPUBeat AI Geopolitics Bank of America Defends TSMC Amid…

Bank of America Defends TSMC Amid Market Concerns

Despite growing competition, Bank of America reiterates its Buy rating on TSMC, citing strong growth potential in advanced semiconductor nodes and packaging technologies.

TSMC's growth and competitive edge — Taiwan Semiconductor Manufacturing Co., Haas Liu
Bank of America Defends TSMC Amid Market Concerns Source: GPUBeat

Bank of America (BofA) has reaffirmed its Buy rating on Taiwan Semiconductor Manufacturing Co. (TSMC), dismissing recent market concerns about the company's dominant position in the semiconductor industry as exaggerated. Following a technology symposium in Taiwan, analyst Haas Liu maintained a price target of 2,560 Taiwan dollars for TSMC, stating that the firm's technological leadership continues to widen its gap against competitors like Samsung and Intel.

As TSMC enhances its production capabilities, the company aims for a 25% compound annual growth rate in capacity from 2022 to 2027, focusing on its 3nm and 5nm nodes. By the fourth quarter of 2026, TSMC's 3nm capacity is expected to reach 190,000 wafers per month, increasing to 230,000 by 2027. In contrast, BofA estimates that Samsung’s SF3 and Intel's 18A processes will only achieve 20,000 to 25,000 wafers per month, primarily for internal use and at lower yields. This gap significantly reduces the chances of Apple shifting its M-series chipsets away from TSMC.

Looking further ahead, TSMC targets an impressive 70% compound annual capacity growth for its next-generation N2 node between 2026 and 2028. The company plans to roll out five fabrication facilities simultaneously, which will cut technology transfer times by 20%. Notably, TSMC has already met its targeted defect density levels for N2 ahead of schedule, showcasing its operational efficiency.

In advanced packaging, TSMC is expanding its CoWoS and SoIC capacity at remarkable rates of 80% and 90% respectively through 2027. BofA highlighted that TSMC's CoWoS yield exceeds 98%, while Intel's competing EMIB-T process has not reached this level, with pilot yields stuck between 80% and 85%. This execution risk could present significant challenges for Intel if it cannot achieve a 95% mass production yield by mid-2027.

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The semiconductor sector is experiencing increasing competitive pressure, but TSMC's strategic focus on advanced nodes and packaging capabilities positions it strongly for ongoing growth. BofA’s optimistic view reflects confidence not only in TSMC’s current operational metrics but also in its long-term strategic vision, which appears resilient amid evolving market dynamics.

As the industry progresses, demand for advanced semiconductor technologies is likely to continue escalating, driven by trends in AI and GPU networks. TSMC's ability to scale production while maintaining high-quality yields will be crucial for its market leadership as new players enter and existing rivals intensify their efforts to capture market share.

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Desk · joined 2026

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